Applikazzjonijiet ta 'fojl tar-ram f'pakketti taċ-ċippa

Fojl tar-ramis becoming increasingly important in chip packaging due to its electrical conductivity, thermal conductivity, processability, and cost-effectiveness. Hawnhekk hawn analiżi dettaljata tal-applikazzjonijiet speċifiċi tagħha fl-imballaġġ taċ-ċippa:

1. Twaħħil tal-wajer tar-ram

• Sostituzzjoni għal wajer tad-deheb jew tal-aluminju
• Prestazzjoni elettrika msaħħa: Copper wire bonding offers lower resistance and better thermal conductivity in high-frequency and high-current applications, effectively reducing power loss in chip interconnections and improving overall electrical performance. Għalhekk, l-użu ta 'fojl tar-ram bħala materjal konduttiv fil-proċessi ta' twaħħil jista 'jsaħħaħ l-effiċjenza u l-affidabbiltà tal-imballaġġ mingħajr ma jżidu l-ispejjeż.
• Użat f'elettrodi u mikro-bumps: In flip-chip packaging, the chip is flipped so that the input/output (I/O) pads on its surface are directly connected to the circuit on the package substrate. Fojl tar-ram jintuża biex isiru elettrodi u mikro-bumps, li huma ssaldjati direttament mas-sottostrat. Ir-reżistenza termali baxxa u l-konduttività għolja tar-ram jiżguraw trasmissjoni effiċjenti ta 'sinjali u qawwa.
• Affidabilità u ġestjoni termali
• Materjal tal-qafas taċ-ċomb: Fojl tar-ramhuwa użat ħafna fl-imballaġġ tal-qafas taċ-ċomb, speċjalment għall-ippakkjar tal-apparat tal-enerġija. The lead frame provides structural support and electrical connection for the chip, requiring materials with high conductivity and good thermal conductivity. Fojl tar-ram jissodisfa dawn ir-rekwiżiti, u jnaqqas b'mod effettiv l-ispejjeż tal-imballaġġ filwaqt li jtejjeb id-dissipazzjoni termali u l-prestazzjoni elettrika.
• Tekniki ta 'trattament tal-wiċċ: In practical applications, copper foil often undergoes surface treatments such as nickel, tin, or silver plating to prevent oxidation and improve solderability. Dawn it-trattamenti jtejbu aktar id-durabilità u l-affidabbiltà tal-fojl tar-ram fl-imballaġġ tal-qafas taċ-ċomb.
• Materjal konduttiv fil-moduli b'ħafna ċipep: System-in-package technology integrates multiple chips and passive components into a single package to achieve higher integration and functional density. Fojl tar-ram jintuża biex jimmanifattura ċirkwiti interkonnessi interni u jservi bħala mogħdija ta 'konduzzjoni kurrenti. This application requires copper foil to have high conductivity and ultra-thin characteristics to achieve higher performance in limited packaging space.
• Applikazzjonijiet RF u Millimeter-Wave
• Użat f'saffi ta 'tqassim mill-ġdid (RDL): Fl-imballaġġ tal-fan-out, il-fojl tar-ram jintuża biex jinbena s-saff ta 'tqassim mill-ġdid, teknoloġija li terġa' tqassam iċ-ċippa I / O għal żona akbar. The high conductivity and good adhesion of copper foil make it an ideal material for building redistribution layers, increasing I/O density and supporting multi-chip integration.
• Tnaqqis tad-daqs u integrità tas-sinjal
• Bjar tas-sħana tal-fojl tar-ram u kanali termali
• Użat fit-teknoloġija permezz tas-silikon permezz (TSV)

2. Ippakkjar Flip-Chip

3. Ippakkjar tal-qafas taċ-ċomb

4. System-in-Package (SIP)

5. Ippakkjar tal-fan-out

6. Applikazzjonijiet ta 'ġestjoni termali u dissipazzjoni tas-sħana

7. Teknoloġiji Avvanzati tal-Imballaġġ (bħal 2.5D u 3D imballaġġ)